Speaker：Wang Xiaopeng, Senior Engineering
Time：15：00 June 28th, 2016
Venue：Yifu Building 207, Wenchang Campus
SoC is an integrated circuit (IC) chip that integrates components such as CPU cores, DSP cores, AD/DA, digital circuits, and software into a single chip. The typical applications of SoCs are in the areas of embedded systems, mobile devices, or even high performance computers. In an SoC, the modules which occupy the largest chip area are the so-called embedded memories. The most popular embedded memories are embedded SRAMs which are configured as the cache of CPU cores. The power consumption, speed, manufacturing yield, and reliability of embedded SRAMs have significant impacts the SoC chips.
As process nodes are getting smaller and closing to the physical limit, embedded SRAMs bring new challenges in testing, repairing, and yield improvement. I will introduce the state of the art industry design methodology of embedded SRAMs. I will also talk about my Ph.D. research where I provided a detailed treatment of yield related techniques which contributes to an efficient design of embedded SRAMs through the utilization of a memory compiler. As Moore’s law is ending, the future ICs technologies were introduced too.